What is the correct sequence for preparing a soldered joint?

The correct sequence for preparing a soldered joint begins with cleaning the surfaces that will be joined. Cleaning is crucial because any dirt, grease, or oxidation can prevent the solder from adhering properly, leading to a weak joint. The next step is to apply flux, which facilitates the flow of solder and helps to prevent oxidation during the heating process. After the surfaces are cleaned and the flux is applied, the next step is to heat the joint. The application of heat causes the solder to melt when it's applied; the solder should be in contact with the heated area to ensure it adheres. Finally, when the joint reaches the appropriate temperature, the solder is introduced, melting and flowing into the cleaned and fluxed joint to create a strong bond.

This sequence is especially important in boiling applications where the integrity of joints can impact safety and performance. Proper preparation ensures that the soldered joint is not only effective but also durable under pressure and temperature changes that high pressure boilers may encounter.